Inside our precision laboratory, Shawn Richeson examines hard drives, solid-state drives, and M.2 NVMe modules beneath a forensic-grade microscope. We diagnose microscopic solder fractures, damaged controller pins, and oxidized vias at the trace level—often under 400× magnification. Reflow soldering and component re-seating restore electrical continuity without disturbing platter alignment or firmware calibration. Each subsystem—read heads, actuator assemblies, NAND packages, and bridge controllers—is documented and imaged sector-by-sector, preserving checksum accuracy and thermal balance during the recovery process. What begins as mechanical failure ends as verified data integrity.

When removable media fail at the electronic or logical layer, we employ cross-protocol analysis between USB 2.0, 3.x, and microcontroller buses. Our process isolates NAND flash matrices, decodes proprietary ECC correction tables, and reconstructs address translation layers through algorithmic entropy balancing. Using quantum-level charge decay modeling and phase-shift microscopy, bit stability is verified before reassembly. We apply cryptographic validation using dual-hash authentication (MD5 and SHA-256) to confirm every sector’s integrity, ensuring the recovered filesystem is mathematically identical to its original state. This workflow produces scientifically repeatable, court-defensible recoveries under ISO-9001 documentation standards.